Tin is a soft, ductile, silvery-white metal that is not easily oxidized in air. It has good conductivity and corrosion resistance while enhancing solderability of substrates that are not otherwise easily soldered to. For substrates alloyed with zinc (such as brass alloys) it is generally recommended to apply a diffusion barrier of nickel plating or copper plating to prevent zinc migration into the tin deposit and resultant intermetallic formation.